Innovative Megasonic Cleaning Technology Evaluated Through Direct Wafer Bonding
Innovative Megasonic Cleaning Technology Evaluated Through Direct Wafer Bonding
复制标题
通过直接晶圆键合评估创新兆声波清洗技术
DOI：
10.1149/1.3483540
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发表时间：
2010
期刊：
影响因子：
--
通讯作者：
V. Dragoi
中科院分区：
文献类型：
--
作者：
F. Fournel;L. Bally;D. Dussault;V. Dragoi
就微粒污染而言，不同的微电子工艺需要非常干净的表面。其中，直接晶圆键合对颗粒清洁度有很高的要求。目前的工作描述了利用传感器设计的单晶圆超声速清洁方法的开发，测试和验证，该方法满足生产规模晶圆键合和其他非常低颗粒应用的极端颗粒中性，颗粒去除效率和可重复性要求。晶圆键合也将用作表征技术。
Different microelectronic processes require very clean surfaces in terms of particulate contamination. Among them, direct wafer bonding has very aggressive requirement in terms of particulate cleanliness. Current work describes development, testing and verification of a single wafer megasonic cleaning method utilizing a transducer design that meets extreme particle neutrality, particle removal efficiency and repeatability requirements of production scale wafer bonding and other very low particle applications. Wafer bonding will also be used as a characterization technique.