PDMS residues-free micro/macrostructures on flexible substrates
PDMS residues-free micro/macrostructures on flexible substrates
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DOI：
10.1016/j.mee.2015.04.037
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发表时间：
2015-03-25
影响因子：
2.3
通讯作者：
Laidani, Nadhira
中科院分区：
文献类型：
--
作者：
Dahiya, Ravinder;Gottardi, Gloria;Laidani, Nadhira
转移印刷最近被报道为柔性基板上的电子产品的一种可行的方法。该方法包括通过使用诸如聚(二甲基硅氧烷)(PDMS)的弹性转移基板将诸如导线或超薄芯片的微/宏观结构从硅(硅)晶片转移到柔性基板。在这一过程中的一个主要挑战是PDMS的残留物，这些残留物在纳米结构转移后残留在硅表面。作为绝缘体，PDMS残留物使金属连接变得困难，从而对将纳米结构用作有源电子的构建块的方式提出了挑战。提出了一种将硅微/宏观结构无残基转移到聚酰亚胺(PI)等柔性衬底上的方法。通过将转移结构浸泡在季铵氟化物(如四丁基氟化铵)和非羟基非质子溶剂(如丙二醇甲基乙酸乙酯)的溶液中，将PDMS残基从硅表面去除。残留物的去除速度(类似于1.5微米/分钟)大约是传统干法蚀刻方法的五倍。与传统的替代方法不同，该方法在不攻击柔性PI衬底的情况下去除了PDMS。(C)2015年提交人。爱思唯尔出版公司(Elsevier B.V.)
Transfer printing has been reported recently as a viable route for electronics on flexible substrates. The method involves transferring micro-/macrostructures such as wires or ultra-thin chips from Si (silicon) wafers to the flexible substrates by using elastomeric transfer substrates such as poly(dimethylsiloxane) (PDMS). A major challenge in this process is posed by the residues of PDMS, which are left over on Si surface after the nanostructures have been transferred. As insulator, PDMS residues make it difficult to realize metal connections and hence pose challenge in the way of using nanostructures as the building blocks for active electronics. This paper presents a method for PDMS residues-free transfer of Si micro-/macrostructures to flexible substrates such as polyimide (PI). The PDMS residues are removed from Si surface by immersing the transferred structures in a solution of quaternary ammonium fluoride such as TBAF (Tetrabutylammonium Fluoride) and non-hydroxylic aprotic solvent such as PMA (propylene glycol methyl ether acetate). The residues are removed at a rate (similar to 1.5 mu m/min) which is about five times faster than the traditional dry etch methods. Unlike traditional alternatives, the presented method removes PDMS without attacking the flexible PI substrates. (C) 2015 The Authors. Published by Elsevier B.V.