Dynamic properties of screw dislocations in Cu: A molecular dynamics study
Dynamic properties of screw dislocations in Cu: A molecular dynamics study
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Cu 中螺旋位错的动态特性：分子动力学研究
DOI：
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发表时间：
2003
期刊：
影响因子：
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通讯作者：
G. Makov
中科院分区：
文献类型：
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作者：
Dan Mordehai;Y. Ashkenazy;I. Kelson;G. Makov
采用恒应力和温度分子动力学方法研究了应力作用下Cu中单个位错的动力学性质。位错被发现加速到一个终端速度。终端速度最初随应力线性增加，最后渐近地接近剪切波速。在线性状态下，确定阻力系数。结果与高温下的实验数据相当，在低温下高出一个数量级。位错宽度被发现周期性地振荡，与堆垛层错能和弹性系数确定的周期。
The dynamic properties of a single dislocation in Cu under an applied stress are studied using constant stress and temperature molecular dynamics. The dislocation is found to accelerate to a terminal velocity. The terminal velocity initially increases linearly with stress and finally approaches the shear wave velocity asymptotically. In the linear regime the drag coefficient is determined. The results are comparable with the experimental data at high temperatures and an order of magnitude higher at low temperatures. The dislocation width is found to oscillate periodically, with a period determined by the stacking fault energy and the elastic coefficients.