Direct metallisation of polyetherimide substrates by activation with different metals
Direct metallisation of polyetherimide substrates by activation with different metals
复制标题
DOI：
10.1016/j.surfcoat.2019.01.023
复制
发表时间：
2019-02-25
影响因子：
5.4
通讯作者：
Marques-Hueso, Jose
中科院分区：
文献类型：
--
作者：
Jones, Thomas D. A.;Ryspayeva, Assel;Marques-Hueso, Jose
本文报道了不同的金属离子和纳米颗粒（Ag、Cu、Ni、Pd、Cr、Co、Au和Fe）用作种子层，通过化学还原或光学还原形成，用于金属轨道到聚醚酰亚胺（PEI）上的化学镀铜的性能。通过结合力、电导率、镀速、XPS、SEM、XRD和EDX等测试手段对镀层性能进行了测试。Cu和Ag晶种的应用导致高质量的无电Cu沉积物，与本体铜（5.96 X 10（7）S/m）相比，该无电Cu沉积物呈现出强粘附特性和高电导率（分别为（2.0 +/-0.5）X 10（7）S/m和（3.6 +/-0.2）X 10（7）S/m）。性能归因于种子层的高表面密度和均匀性。在这些金属中，只有Ag离子在所施加的条件下被光还原，随后被用于化学镀铜150 μ m宽的高质量轨道特征。在Ag离子交换之前将硫酸预处理应用于PEI，改善了光引发的轨道形成过程，如通过表面上的光诱导Ag纳米颗粒密度和化学镀铜速率的三倍增加以及改善的化学镀铜对PEI的粘附所证明的。
This article reports the performance of different metallic ions and nanoparticles (Ag, Cu, Ni, Pd, Cr, Co, Au and Fe) used as seed layers, formed by chemical or optical reduction, for the electroless Cu plating of metal tracks onto polyetherimide (PEI). Plated Cu performance was tested by adhesion, electrical conductivity, plating rate, XPS, SEM, XRD and EDX analysis. The application of Cu and Ag seeds resulted in high quality electroless Cu deposits presenting strong adhesion properties and high conductivity ((2,0 +/- 0.5) x 10(7) S/m and (3.6 +/- 0.2) x 10(7) S/m, respectively) compared with bulk copper (5.96 x 10(7) S/m). Performance is attributed to the high surface density and uniformity of seed layers. Of the metals, only Ag ions were photoreduced under the conditions applied and were subsequently used to electroless Cu plate high quality track features of 150 mu m width. The application of sulphuric acid pre-treatment to PEI prior to Ag ion exchange, improved the photo-initiated track formation process, as demonstrated by a threefold increase to both photoinduced Ag nanoparticle density on the surface and electroless Cu plating rate, as well as improved electroless Cu adhesion to PEI.