Fabrication and Plasma Exposure of Fine-Grained Tungsten/Copper Functionally Graded Materials in the HT-7 Tokamak
Fabrication and Plasma Exposure of Fine-Grained Tungsten/Copper Functionally Graded Materials in the HT-7 Tokamak
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DOI：
10.13182/fst08-a1740
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发表时间：
2008-04
影响因子：
0.9
通讯作者：
F. Chong;J. Chen;Z. Zhou;J. Li
中科院分区：
文献类型：
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作者：
F. Chong;J. Chen;Z. Zhou;J. Li
摘要采用常压电阻烧结法制备了五层结构的W/Cu功能梯度材料，其晶粒尺寸分别为0.2、1和7 μm。显微组织分析发现，它们具有良好的梯度成分分布和力学性能。在HT-7超导托卡马克装置上进行了约2000 s的边缘等离子体暴露，结果表明，细晶钨能提高材料的机械强度，有利于抑制裂纹的扩展和长大，但对杂质沉积和化合物形成的影响不明显。
Abstract Five-layered W/Cu functionally graded materials with fine grain sizes of 0.2, 1, and 7 μm were fabricated by resistance sintering under ultrahigh pressure. Microstructure analysis found that they have a good graded composition distribution and mechanical properties. After about 2000 s edge plasma exposure in the HT-7 superconducting tokamak, the results indicated that the fine-grained tungsten can enhance mechanical strength, and it is favorable to hold back crack propagation and growth; however, the effects on impurity deposition and compound formation were not obvious.