Effect of Post-Weld Annealing on Microstructure and Growth Behavior of Copper/Aluminum Friction Stir Welded Joint.
Effect of Post-Weld Annealing on Microstructure and Growth Behavior of Copper/Aluminum Friction Stir Welded Joint.
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焊后退火对铜/铝搅拌摩擦焊接头显微组织和生长行为的影响
DOI：
10.3390/ma13204591
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发表时间：
2020-10-15
期刊：
影响因子：
--
通讯作者：
Zhou Z
中科院分区：
文献类型：
--
作者：
Jin Y;Wu B;Lu X;Xing Y;Zhou Z
以上侧为铜、下侧为铝的搭接焊形式，对1016纯铝和厚度为2 mm的T2纯铜进行搅拌摩擦焊。研究了1016纯铝与T2纯铜搅拌摩擦焊接界面组织的生长规律。通过300、350、400 °C退火，揭示了Cu-Al搭接接头中金属间化合物（IMC）层的生长机制。在退火过程中，搭接接头中的金属间化合物（IMC）层再次生长，并且在较低的退火温度和保温时间下，仅金属间化合物（IMC）层的原始结构生长。在较高的退火温度和保温时间下，原始结构的金属间化合物（IMC）层不再生长，在原始结构的中间出现新的层状结构。熔核区的显微硬度呈梯度变化。随着保温时间的不同，铜和铝两侧的金属出现不同的软化现象。当硬度下降到一定程度时，不会随着保温时间的增加而继续下降。当退火温度为350 °C和400 °C时，拉伸试样的强度随保温时间的增加先增加后降低。在Cu-Al界面处，断裂贯穿整个金属间化合物层。
Friction stir welding of 1016 pure aluminum and T2 pure copper with 2 mm thickness was carried out in the form of lap welding of copper on the upper side and aluminum on the lower side. The growth of interface microstructure between 1016 pure aluminum and T2 pure copper welded by friction stir welding was studied. The growth mechanism of the intermetallic compound (IMC) layer in the Cu-Al lap joint was revealed by annealing at 300, 350, 400 °C. The intermetallic compound (IMC) layer in the lap joint grows again during annealing, and only the original structure of the intermetallic compound (IMC) layer grows at lower annealing temperature and holding time. At higher annealing temperature and holding time, the original structure of intermetallic compound (IMC) layer no longer grows, and a new layered structure appears in the middle of the original structure. There is a gradient change of microhardness in the nugget zone. With different holding times, different softening phenomena appear in the metals on both sides of copper and aluminum. When the hardness decreases to a certain extent, it will not continue to decrease with the increase of holding time. When the annealing temperature is 350 °C and 400 °C, the strength of the tensile sample increases first and then decreases with the increase of holding time. At the interface of Cu-Al, the fracture runs through the whole intermetallic compound (IMC) layer.
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影响因子：
4.7
作者：
Mahto, Raju Prasad;Kumar, Ravi;Pal, Surjya Kanta
通讯作者：
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DOI：
10.1179/136217110x12785889549543
发表时间：
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影响因子：
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作者：
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作者：
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Ojo, Olatunj Oladimeji
DOI：
10.1016/s1003-6326(18)64675-8
发表时间：
2018-03-01
影响因子：
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作者：
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通讯作者：
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