3.2 Zen: A next-generation high-performance ×86 core

3.2 Zen: A next-generation high-performance ×86 core
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3.2 Zen:下一代高性能×86核心

DOI:
10.1109/isscc.2017.7870256
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发表时间:
2017
期刊:
2017 IEEE International Solid-State Circuits Conference (ISSCC)
影响因子:
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通讯作者:
Michael Co
Michael Co
中科院分区:
--
文献类型:
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作者:
T. Singh;S. Rangarajan;Deepesh John;Carson Henrion;Shane Southard;H. McIntyre;Amy Novak;S. Kosonocky;Ravi Jotwani;Alex Schaefer;E. Chang;J. Bell;Michael Co

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代号为“Zen”的AMD下一代高性能×86内核面向服务器、桌面和移动的客户端应用。利用Global Foundries的节能14 nm LPP FinFET工艺,44 mm2 Zen核心复合单元(CCX)具有1.4 B晶体管,并包含共享的8MB L3缓存和四个核心(图3.2.7)。7mm2 Zen内核包含专用的0.5MB L2缓存、32KB L1数据缓存和64KB L1指令缓存。每个内核都有一个数字低压差(LDO)稳压器和数字频率合成器(DFS),可独立改变电源状态下的频率和电压。
Codenamed “Zen”, AMD's next-generation, high-performance ×86 core targets server, desktop, and mobile client applications. Utilizing Global Foundries' energy-efficient 14nm LPP FinFET process, the 44mm2 Zen core complex unit (CCX) has 1.4B transistors and contains a shared 8MB L3 cache and four cores (Fig. 3.2.7). The 7mm2 Zen core contains a dedicated 0.5MB L2 cache, 32KB L1 data cache, and 64KB L1 instruction cache. Each core has a digital low drop-out (LDO) voltage regulator and digital frequency synthesizer (DFS) to independently vary frequency and voltage across power states.