Thermal Management Using MEMS Bimorph Cantilever Beams
Thermal Management Using MEMS Bimorph Cantilever Beams
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DOI：
10.1007/s11340-016-0170-1
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发表时间：
2016-09-01
影响因子：
2.4
通讯作者：
Starman, L. A.
中科院分区：
文献类型：
--
作者：
Coutu, R. A., Jr.;LaFleur, R. S.;Starman, L. A.
本文研究了一种利用微电子机械系统(MEMS)对电子器件进行局部热管理的被动冷却技术。原型采用解析方程进行设计，使用有限元方法进行模拟，并采用商用PolyMUMPs(TM)工艺进行制造。该系统由电子器件模拟器(EDS)和MEMS双压片悬臂梁(MBCB)阵列组成，梁长度分别为200、250和300微米，测试了梁的偏转和热行为。响应于与EDS相关的加热(即，首先对应于EDS的最热部分首先激励最长的光束)，选择要激励的特定光束长度。结果表明，在热激励作用下，梁的偏转达到了设计要求，并通过热传导有效地传递了热量。梁达到“净零”挠度时的温度与初始挠度距离有关，而接触挠度温度和驱动速率与梁的长度有关。释放后的初始光束偏转和完全启动时的接触温度分别约为5.05、9.45、14.05微米和231、222、216摄氏度，较长的光束首先接触。这一创新的被动式热管理系统能够选择性地冷却设备，而无需主动控制或强制对流，以保持敏感微电子设备的稳定工作温度。
This paper examines a passive cooling technique using microelectromechanical systems (MEMS) for localized thermal management of electronic devices. The prototype was designed using analytic equations, simulated using finite element methods (FEM), and fabricated using the commercial PolyMUMPs (TM) process. The system consisted of an electronic device simulator (EDS) and MEMS bimorph cantilever beams (MBCB) array with beams lengths of 200, 250, and 300 mu m that were tested to characterize deflection and thermal behavior. The specific beam lengths were chosen to actuate in response to heating associated with the EDS (i.e. the longest beams actuated first corresponding to the hottest portion of the EDS). The results show that the beams deflected as designed when thermally actuated and effectively transferred heat away via thermal conduction. The temperature when the beams reached "net-zero" deflection (i.e. uncurled and flat) was related to the initial deflection distance while the contact deflection temperature and rate of actuation was related to beam length. Initial beam deflections, after release, and contact temperatures, when fully actuated, were approximately 5.05, 9.45, 14.05 mu m, and 231, 222, 216 A degrees C, respectively with the longer beams making contact first. This innovative passive thermal management system enables selective device cooling without requiring active control or forced convection to maintain steady-state operating temperatures for sensitive microelectronic devices.