Effect of copper nanoparticle addition on the electrical and optical properties of thin films prepared from silver nanoparticles
Effect of copper nanoparticle addition on the electrical and optical properties of thin films prepared from silver nanoparticles
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DOI：
10.1007/s10853-014-8564-x
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发表时间：
2014
影响因子：
4.5
通讯作者：
G. Qin;Lidan Fan;A. Watanabe
中科院分区：
文献类型：
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作者：
G. Qin;Lidan Fan;A. Watanabe
本研究以纳米银和铜为原料，采用简单的旋涂法制备了银(Ag)和铜(Cu)掺杂的透明导电薄膜。添加少量的Cu-NP抑制了Ag-NP的聚集和热处理引起的颗粒形成，即使厚度在10 nm量级也能获得连续的薄膜。当Np溶液前驱体的总金属浓度为5wt%，银铜比为95：5时，银铜薄膜的表面电阻率(ρS)为3.17ngWt/sq，当浓度降至3.5wt%时，其ρs值为16.3ngWt/sq。后者的透过率超过60%，在近紫外区(300-400 nm)的328 nm处达到最大值82.1%，而在可见光(400-700 nm)和近红外区的透过率下降到约38%。热处理过程中薄膜的不均匀性增加，导致电导率随时间延长而降低。
The fabrication of transparent and conductive silver (Ag) and copper (Cu)-doped Ag films using simple spin-coating method with Ag and Cu nanoparticles (NPs) as starting material is described in this study. The aggregation of Ag NP and the grain formation caused by heat treatment were hindered by the addition of small amount Cu NP, and a continuous film was obtained even though the thickness was in the order of 10 nm. When the total metal concentration of NP solution precursor was 5 wt% with the ratio between Ag and Cu being 95:5, the surface resistivity (ρs) of Ag–Cu film was 3.17 Ω/sq; and when the concentration was reduced to 3.5 wt%, theρswas 16.3 Ω/sq. The transmission of latter was more than 60 % with the maximum value 82.1 % at 328 nm in the near-UV region (300–400 nm), however, decreased to about 38 % in the visible region (400–700 nm) and near-IR region. The inhomogeneity of the film increased leading to the decrease of the conductivity with the time extension during the heat treatment.