Development and characterization of strong, heat-resistant and thermally conductive polyimide/nanodiamond nanocomposites
Development and characterization of strong, heat-resistant and thermally conductive polyimide/nanodiamond nanocomposites
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DOI：
10.1016/j.polymer.2021.124098
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发表时间：
2021-08-16
期刊：
影响因子：
4.6
通讯作者：
Katanosaka, Masashi
中科院分区：
文献类型：
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作者：
Morimune-Moriya, Seira;Obara, Keiya;Katanosaka, Masashi
本研究采用原位聚合法制备了聚酰亚胺(PI)/纳米金刚石(ND)聚合物纳米复合材料。聚酰胺酸(PAA)是聚酰亚胺(PI)的前体，在ND存在下聚合。在纳米尺度上，ND在PI中高度分散。当Nd含量很低时，材料具有优良的力学性能和热性能。当Nd含量为0.1wt%时，材料的杨氏模量提高了约70%。热分解温度(从544℃到572℃)和熔点(从593℃到610℃)的显著提高是通过添加0.01wt%的负载实现的。此外，PI/ND纳米复合材料具有与商业上可用的热界面材料相当的高导热系数。据我们所知，通过如此低的填料含量来如此强烈地提高性能尚未见报道。
In this study, polymer nanocomposites based on polyimide (PI) and nanodiamond (ND) were prepared by in-situ polymerization. Polyamic acid (PAA), a precursor of PI, was polymerized in the presence of ND. ND was highly dispersed in PI at nanoscale. The excellent mechanical and thermal properties were achieved at very low content of ND. The Young's modulus increased approximately by 70% at ND content of 0.1 wt%. The strong enhancements in the thermal decomposition temperature (from 544 degrees C to 572 degrees C) and the melting point (from 593 degrees C to 610 degrees C) were achieved by the addition of only 0.01 wt% ND loading. Moreover, the PI/ND nanocomposites exhibited the high thermal conductivity comparable to that of commercially available thermal interface materials. To the best of our knowledge, such a strong enhancement in the properties by such a low filler content have not been reported yet.