Lead free interconnect materials for the electronics industry
Lead free interconnect materials for the electronics industry
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DOI：
10.1109/iemt.1995.526121
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发表时间：
1995-10
期刊：
影响因子：
--
通讯作者：
D. Napp
中科院分区：
文献类型：
--
作者：
D. Napp
过去 25 年，许多制造领域进行了大量的开发和研究，以减少铅的使用并限制人类接触铅和含铅产品。少量的铅会损害儿童的神经系统。铅的主要来源是摄入的油漆（75%）和饮用水（20%）。从所有制造产品中消除铅，无论是通过立法还是通过税收优惠，都将对电子互连技术产生重大影响。 1993 年，国家制造科学中心 (NCMS) 是一个由超过 215 家美国北美制造商组成的非营利性合作研究联盟，建立了多年计划。无铅焊料项目 (LFSP) 和导电聚合物互连项目 (CPIP) 涉及来自工业界、学术界和国家实验室的参与者。这些计划的目的是确定电子行业中含铅焊料的无铅焊料替代品和导电聚合物材料。新材料必须满足零下 55 至 +180 摄氏度工作环境下的互连性能要求。电子制造商已在特定应用中使用了多种无铅合金焊料，每种焊料都具有独特的性能。导电粘合剂的主要用途是消费电子产品和儿童玩具。在将这些新型无铅材料应用于广泛的电子行业之前，需要进行大量的研究和开发。 NCMS 项目涉及材料特性、可制造性、建模和可靠性预测、经济影响和毒理学特性的研究。
Considerable development and research has been conducted over the last 25 years by many areas of manufacturing to reduce the use of lead and to limit human exposure to lead and products containing lead. Small levels of lead can damage the nervous system of children. Major sources of lead are ingested paint, 75%, and drinking water, 20%. The elimination of lead from all manufacturing products, whether through legislation or through tax incentives, will have a significant impact on the electronic interconnect technologies. In 1993 the National Center for Manufacturing Sciences (NCMS), a not-for-profit cooperative research consortium of more than 215 U.S. North American manufacturers, established multi-year programs. Lead Free Solder Project (LFSP) and Conductive Polymer Interconnect Project (CPIP) involving participants from industry, academia, and national laboratories. The objective of these programs is to identify lead free solder alternative replacement(s) and conductive polymeric materials for lead bearing solders in the electronics industry. The new materials must meet the interconnect performance requirements at operating environments ranging from-55 to +180 degrees centigrade. Numerous lead free alloy solders, each exhibiting unique properties, have been used by electronic manufacturers in specific applications. The major usage of conductive adhesives has been in consumer electronics and children's toys. Before any of these new lead free materials can be applied to the widely diverse electronics industry considerable research and development is required. The NCMS programs involve a study of the material properties, manufacturability, modeling and reliability predictions, economic impact, and toxicological properties.