Effects of Excimer Irradiation Treatment on Thermocompression Au–Au Bonding
Effects of Excimer Irradiation Treatment on Thermocompression Au–Au Bonding
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DOI：
10.1143/jjap.49.06gn12
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发表时间：
2010-06
影响因子：
1.5
通讯作者：
N. Unami;K. Sakuma;J. Mizuno;S. Shoji
中科院分区：
文献类型：
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作者：
N. Unami;K. Sakuma;J. Mizuno;S. Shoji
我们研究了真空紫外光(VUV)处理作为Au-Au倒装芯片键合表面改性技术的可行性。对于三维(3D)堆叠应用中的细节距电互连，需要坚固可靠的键合；在这种情况下，在键合过程之前需要进行表面改性处理。采用真空紫外光表面处理去除有机污染物。用X射线光电子能谱(XPS)对电镀Au焊盘样品进行了分析，以评估Au表面的化学成分。XPS结果表明，真空紫外光处理去除了表面的碳基污染物。粘结试件的剪切强度也得到了提高。经VUV处理的凸起的平均剪切强度是未经VUV处理的凸起的1.6倍。结合样品的横截面扫描电子显微镜(SEM)图像证实没有空洞和裂纹。结果表明，真空紫外光处理对Au-Au倒装芯片键合有明显的影响。
We studied the feasibility of using vacuum ultraviolet (VUV) treatment as a surface improvement technique with Au–Au flip-chip bonding. For fine-pitch electrical interconnections in three-dimensional (3D) stack applications, robust and reliable bonding is desirable; in this case, surface modification treatment is needed before the bonding process. A VUV surface treatment was used to remove organic contaminants. Samples of electroplated Au pads were examined by X-ray photoelectron spectroscopy (XPS) to evaluate the chemical composition of the Au surfaces. The XPS results revealed that the carbon-based contaminants on the surface were removed by the VUV treatment. The shear strength of the bonded sample was also improved. The average shear strength of a bump with VUV treatment is 1.6 times larger than that of a bump without VUV treatment. Cross-sectional scanning electron microscopy (SEM) images of the bonded samples confirmed the absence of voids and cracks. The results show that VUV treatment has clear effects on Au–Au flip-chip bonding.