Dynamic compressive fracture of C/SiC composites at different temperatures: Microstructure and mechanism
Dynamic compressive fracture of C/SiC composites at different temperatures: Microstructure and mechanism
复制标题
不同温度下C/SiC复合材料的动态压缩断裂:微观结构与机理
DOI:
10.1016/j.ijimpeng.2017.08.001
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发表时间:
2017-11-01
影响因子:
5.1
通讯作者:
Li, Yulong
中科院分区:
文献类型:
--
作者:
Li, Tao;Duan, Yu;Li, Yulong
Fracture behavior of C/SiC composites under compressive loading is investigated both experimentally and numerically. Dynamic experiments are carried out using a modified split Hopkinson pressure bar (SHPB), along with high-speed photography. A microstructure based approach is employed to model the C/SiC composites, including SiC matrix, voids, warp and weft fiber bundles. Dynamic microstructure response and microdamage evolution are captured accurately by numerical simulations. The fracture plane of the C/SiC composites under quasi-static loading is rough, with fiber bundle splitting and fiber pullout. However, the fracture plane becomes much smoother under dynamic loading, with a negligible fiber bundle splitting or fiber pullout. Two dynamic fracture modes are observed in the high-speed images, and proved to be induced by the inhomogeneous microstructure according to the numerical simulation results. One of the fracture modes improves the toughness of the C/SiC composites significantly (an increase of 35%), mostly without strength decrease. Moreover, the low-temperature heat treatment significantly influences the mechanical properties (e.g. elastic modulus, strength, and fracture strain) of the C/SiC composites, owing to the increase in the number of microcracks and the decrease in the strength of fiber-matrix interfaces. (C) 2017 Elsevier Ltd. All rights reserved.