Shear bond strength to dentine of dental adhesives containing hydroxyapatite nano-fillers

Shear bond strength to dentine of dental adhesives containing hydroxyapatite nano-fillers
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DOI:
10.1080/01694243.2016.1197086
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发表时间:
2016-01-01
影响因子:
2.3
通讯作者:
Miletic, Vesna
Miletic, Vesna
中科院分区:
材料科学3区
文献类型:
--
作者:
Lezaja, Maja;Jokic, Bojan M.;Miletic, Vesna

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本研究的目的是比较羟基磷灰石(HAP)纳米棒(HAP棒)和HAP纳米棒(HAP棒)添加到商业粘合剂中对牙本质宏观剪切粘结强度(SBS)和粘合剂-牙本质界面形态的影响。将HAP以水悬浮液的形式加入到Single Bond Universal(SBU,3 M ESPE)和Te-Econom Bond(TeE; Ivoclar Vivadent)中,以避免纳米颗粒的团聚并实现0.5、1.0和1.5重量%的HAP浓度。在“全蚀刻”或“自蚀刻”方案之后,将粘合剂施加到162个完整的人类第三磨牙(N = 6/组)的平坦牙本质表面。复合材料(Z250,3 M ESPE)使用直径为3 mm的分体式不锈钢模具构建。使用万能试验机以1 mm/min测试SBS直至断裂。使用双向和单向方差分析和Tukey事后检验(α = 0.05)对数据进行统计学分析。HAP(棒)对受试粘合剂的SBS没有显着影响,而HAP(棒)仅改善了“全蚀刻”全蚀刻方案后应用的粘合剂与牙本质的粘结强度。在全蚀刻方案后施加的含有1%HAP(棒)的SBU(15.10 +/- 2.96 MPa)和含有0.5%HAP(棒)的TeE(12.96 +/- 4.48 MPa)的SBS值高于它们各自的对照组(10.36 +/- 2.68和7.97 +/- 3.64 MPa)。具有较高SBS的样品显示出更多的“混合”失效。羟基磷灰石纳米填料可以提高全酸蚀粘接剂的粘接强度,而不会对粘接剂在牙本质上的分散及其渗透牙本质小管的能力产生不利影响。
The aim of this study was to compare the effect of hydroxyapatite (HAP) nano-rods (HAP rods) and HAP nano-sticks (HAP sticks) added to commercial adhesives on the macro-shear bond strength (SBS) to dentine and morphology of the adhesive-dentine interface. HAP was added to Single Bond Universal (SBU, 3M ESPE) and Te-Econom Bond (TeE; Ivoclar Vivadent), in the form of water suspensions to avoid agglomeration of nano-particles and to achieve HAP concentrations of 0.5, 1.0 and 1.5 wt%. Following a 'total-etch' or a 'self-etch' protocol, the adhesives were applied to flat dentine surface of 162 intact human, third molars (N = 6/group). Composite (Z250, 3M ESPE) was built-up using a split stainless steel mould, 3 mm in diameter. SBS was tested using a universal testing machine at 1 mm/min until fracture. Data were statistically analysed using two-way and one-way analysis of variance with Tukey's post-test (alpha = 0.05). HAP(rods) had no significant effect on SBS of the tested adhesives while HAP(sticks) improved bond strength to dentine only of adhesives applied following the 'total-etch' total-etch protocol. SBS values of SBU containing 1% HAP(sticks) (15.10 +/- 2.96 MPa) and TeE containing 0.5% HAP(sticks) applied following the total-etch protocol (12.96 +/- 4.48 MPa) were higher than those of their respective control groups (10.36 +/- 2.68 and 7.97 +/- 3.64 MPa). Samples with higher SBS showed more 'mixed' failures. HAP nano-fillers may improve bond strength of total-etch adhesives without an adverse effect on adhesive dispersion on dentine and its ability to infiltrate dentinal tubules.