RF modeling of vertical interconnection between power-ground plane combined with 2D TLM
RF modeling of vertical interconnection between power-ground plane combined with 2D TLM
复制标题
结合 2D TLM 的电源-地平面之间垂直互连的 RF 建模
DOI：
10.1109/epep.2001.967677
复制
发表时间：
2001
期刊：
影响因子：
--
通讯作者：
R. Jackson
中科院分区：
文献类型：
--
作者：
R. Ito;R. Carrillo;R. Jackson
在本文中，我们提出了一种建模技术，用于寻找可与粗网格二维传输线矩阵方法（2D-TLM）分析结合使用的通孔互连的集总元素模型。该技术允许使用非常简单的二维TLM分析来同时计算插入损耗、回波损耗和多层封装中通过电源-地平面对的多个过路转换的隔离。通过与HFSS的比较，验证了该技术的准确性。
In this paper, we present a modeling technique for finding a lumped element model of a via interconnection that can be used in conjunction with a coarse grid two-dimensional transmission line matrix method (2D-TLM) analysis. The technique allows the use of very simple 2D TLM analysis to simultaneously compute insertion loss, return loss, and isolation of multiple via transitions through a power-ground plane pair in a multilayer package. The accuracy of this technique is validated by comparison to HFSS.