Selective desorption of interfacial SiO2

Selective desorption of interfacial SiO2
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界面SiO2的选择性解吸

DOI:
10.1063/1.1559647
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发表时间:
2003
影响因子:
4
通讯作者:
M. Copel
M. Copel
中科院分区:
物理与天体物理2区
文献类型:
--
作者:
M. Copel

文献摘要

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在这封信中,我们报告了 SiO2 从硅酸盐/Si(001) 界面的选择性热分解,而没有电介质的硅化。我们观察到类似于 SiO2 从 Si(001) 解吸的动力学,这是通过 SiO 挥发而发生的,这表明类似的机制在埋入界面处起作用。界面解吸是一种无需事先去除 SiO2 即可直接形成电介质/硅结构的途径。
In this letter, we report the selective thermal decomposition of SiO2 from a silicate/Si(001) interface, without silicidation of the dielectric. We observe kinetics that are similar to SiO2 desorption from Si(001), which takes place by SiO volatilization, suggesting that a similar mechanism is responsible at a buried interface. Interface desorption is a route to direct dielectric/silicon structures without prior removal of SiO2.