Study on Peeling Behavior in Pick-up Process of IC Chip with Adhesive Tapes
Study on Peeling Behavior in Pick-up Process of IC Chip with Adhesive Tapes
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DOI：
10.1299/jmmp.4.1051
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发表时间：
2010
期刊：
影响因子：
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通讯作者：
N. Saiki;K. Inaba;K. Kishimoto;H. Seno;K. Ebe
中科院分区：
文献类型：
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作者：
N. Saiki;K. Inaba;K. Kishimoto;H. Seno;K. Ebe
对四种不同厚度的胶带材料的拾取性能进行了数值模拟和实验研究。在拾取过程中，针通过推动基材的背面将具有粘合膜的IC芯片从基材剥离。在我们的评价方法中，使用剥离试验测量剥离能量对剥离速度的依赖性。采用有限元方法计算了不同剥离长度下拾取过程的能量释放率。从剥离试验和有限元分析的结果中获得拾取时间。我们的研究结果表明，剥离能量是影响拾取性能的主导属性，并且在拾取过程中样品之间的能量释放速率的差异不显著。此外，最小针位移估计从计算的拾取时间使用我们的方法。最小针位移的实验拾取值与估计结果吻合较好。
A method to evaluate pick-up performance of four kinds of adhesive tape materials with different thickness has been studied numerically and experimentally. Needles peel an IC chip with an adhesive film off the base material in the pick-up process, by pushing the back of the base material. In our evaluation method, the dependence of the peel energy on the peel speed was measured using a peel test. The finite element method was applied to calculate the energy release rate of the pick-up process for various peel lengths. The pick-up time was obtained from the results of the peel tests and the finite element analysis. Our results indicate that the peel energy is the dominant property influencing the pick-up performance, and the difference in energy release rate in the pick-up process between the samples is not significant. Furthermore, the minimum needle displacement was estimated from the calculated pick-up time using our method. The minimum needle displacement of the experimental pick-up values was in good agreement with the estimated result.