Hybrid Pixel Particle-Detector Without Bump Interconnection
Hybrid Pixel Particle-Detector Without Bump Interconnection
复制标题
无凸点互连的混合像素粒子探测器
DOI：
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发表时间：
2009
影响因子：
1.8
通讯作者：
I. Perić
中科院分区：
文献类型：
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作者：
I. Perić
本文介绍了一种无需凸块互连的混合像素粒子探测器。传感器信号通过电容（交流）耦合从传感器传输到读出芯片。为了方便信号传输，在传感器像素中安装了简单的前置放大器。传感器芯片采用标准高压 CMOS 技术，具有 100% 的填充系数和像素内放大功能。传感器采用耗尽型高压 n-阱/p-基底二极管。CMOS 电荷敏感放大器采用双阱设计，置于传感器收集电极（n-阱）内。前置放大器的输出端与传感器芯片顶部金属层中的发射电极相连。读出芯片中接收器的输入端也连接到顶部金属层中的电极。当读出芯片被精确翻转并粘贴到传感器芯片上时，传感器和接收器电极就形成了电容器，从而实现交流信号传输。本报告介绍了使用包含 14 乘以 14 像素、78 乘以 60 mum2 大小的小型测试矩阵所获得的首批测试结果。对噪声、阈值分散和放射源光谱进行了测量。
A hybrid pixel particle-detector which does not require bump-interconnection is presented. The sensor signals are transmitted from the sensor to the readout chip using capacitive (AC) coupling. In order to facilitate the signal transmission, simple preamplifiers are implemented in the sensor pixels. The sensor chip with 100% fill-factor and in-pixel amplification is implemented in a standard high-voltage CMOS technology. Depleted high-voltage n-well/p-substrate diodes are used as sensors. CMOS charge-sensitive amplifiers are placed inside the sensor-collecting electrodes (n-wells) using twin-wells. The outputs of the preamplifiers are connected to transmitter electrodes implemented in the top metal-layer of the sensor chip. The inputs of the receivers in the readout chip are also connected to electrodes in the top metal-layer. When the readout chip is precisely flipped and glued onto the sensor chip, the sensor- and receiver electrodes form capacitors that allow AC signal transmission. The first test results obtained with a small test-matrix containing 14 times 14 pixels of 78 times 60 mum2-size are presented. Noise, threshold dispersion and radioactive source spectra are measured.