Reversible Transition between Discrete and 1D Infinite Architectures: a Temperature-Responsive Cu(I) Complex with a Flexible Disilane-bridged Bis(pyridine) Ligand
Reversible Transition between Discrete and 1D Infinite Architectures: a Temperature-Responsive Cu(I) Complex with a Flexible Disilane-bridged Bis(pyridine) Ligand
复制标题
离散和一维无限结构之间的可逆转变：具有柔性乙硅烷桥联双（吡啶）配体的温度响应性 Cu(I) 配合物
DOI：
10.1002/chem.202204002
复制
发表时间：
2023
期刊：
影响因子：
--
通讯作者：
Y.*
中科院分区：
文献类型：
--
作者：
Zhao;Y.; Nakae;T.; Takeya;S.; Hattori;M.; Saito;D.; Kato;M.; Ohmasa;Y.; Sato;S.; Yamamuro;O.; Galica;T.; Nishibori;E.; Kobayashi;S.; Seki;T.; Yamada;T.; Yamanoi;Y.*
报道了一种基于二硅烷桥连的双（吡啶）配体和CuI的温敏结构变化。单晶X-射线分析表明，Cu（I）配合物中有两种多晶型物：20 °C时的八核铜（I）配合物和−173 °C时的一维阶梯铜（I）聚合物配合物。这些多晶型物的形成是由于配体的柔性。将样品从−10 °C冷却至−170 °C时，观察到Cu−I键的形成。通过DSC、VT-PXRD和VT-光致发光测量澄清了温度诱导的相变过程，并表明可逆的温度控制的晶体到晶体相变。使用高速摄像机在VT台上观察显示，在这些多晶型之间的单晶到单晶转变期间，晶体开裂。
A thermoresponsive structural change based on a disilane‐bridged bis(pyridine) ligand and CuI is reported. Single‐crystal X‐ray analysis revealed that there are two polymorphs in the Cu(I) complex: octanuclear copper(I) complex at 20 °C and 1D staircase copper(I) polymer complex at −173 °C. The formation of these polymorphs is due to the flexibility of the ligand. Cu−I bond formation is observed upon cooling the sample from −10 °C to −170 °C. The temperature‐induced phase transition progression was clarified by DSC, VT‐PXRD, and VT‐photoluminescence measurements and indicated a reversible temperature‐controlled crystal‐to‐crystal phase transition. Observation on a VT‐stage using a high‐speed camera showed crystal cracking during single‐crystal to single‐crystal transitions between these polymorphic forms.