Nanoprocessing of carbon and boron nitride nanoperiod multilayer films
Nanoprocessing of carbon and boron nitride nanoperiod multilayer films
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DOI：
10.1143/jjap.42.l322
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发表时间：
2003-03-15
期刊：
影响因子：
--
通讯作者：
Kim, J
中科院分区：
文献类型：
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作者：
Miyake, S;Kim, J
制备了碳和氮化硼纳米周期多层膜。4纳米周期多层膜的纳米压痕硬度最高，耗散模量最低。评估了原子顺序处理特性对负载的依赖性。这些结果表明，在多层膜的碳层和氮化硼层之间的界面处，加工阻力增大。通过这种加工机制，可以在纳米周期多层膜上进行机械作用逐层去除的纳米加工。可以定量地观察到各加工材料层之间摩擦系数的差异。
Carbon and boron nitride nanoperiod multilayer films were deposited. The nanoindentation hardness and modulus of dissipation of the 4-nm-period multilayer film are the highest and the lowest for such films, respectively. The dependence of atomic order processing properties on the load was evaluated. These results indicate that the processing resistance increased at the interface between the carbon and boron nitride layers of multilayer films. By this processing mechanism, nanoprocessing for layer-by-layer removal by mechanical action is performed on nanoperiod multilayer films. The difference in the friction coefficient between each processed material layer can be observed quantitatively.