Investigation of the chip adhesion mechanisms in micro-drilling of high ceramic-content particle-filled GFRPs
Investigation of the chip adhesion mechanisms in micro-drilling of high ceramic-content particle-filled GFRPs
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DOI：
10.1080/10910344.2020.1765177
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发表时间：
2020-09
影响因子：
2.7
通讯作者：
Xin Huang;Chengyong Wang;Tao Yang;Bingmiao Liao;Xingrong He;Lijuan Zheng
中科院分区：
文献类型：
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作者：
Xin Huang;Chengyong Wang;Tao Yang;Bingmiao Liao;Xingrong He;Lijuan Zheng
摘要 玻璃纤维增强聚合物（GFRP）广泛用于汽车和飞机结构应用中的印刷电路板（PCB）。高陶瓷含量颗粒填充 GFRP 中的微钻孔性能严重影响这些 PCB 的信号传输质量和速度。切屑粘附是高性能微钻孔的最大障碍之一，尤其是对于深径比较大的孔。本文首次研究了对陶瓷颗粒填充的 GFRP 元件（PCB 基板材料）进行微钻孔时的芯片粘附特性和形成机制。提出了一种直接接触温度测量方法来测量层压复合材料钻孔时的温度。研究了加工参数对钻孔温度和切屑粘附力的影响。提出了一种控制芯片粘附的方法。结果表明，芯片粘附可分为四个阶段。减少切屑粘附的有效措施包括降低钻头转速、适当提高进给量、控制钻头刃磨前的钻孔数量等。此外，使用强制冷风有助于散热和有效地提取切屑。结果，芯片粘附力降低。
Abstract Glass-fiber reinforced polymers (GFRP) are widely used for printed circuit boards (PCBs) in automotive and aircraft structural applications. The performance of micro-drilling in high ceramic-content particle-filled GFRP heavily influences the signal transmission quality and speed available from these PCBs. Chip adhesion is one of the biggest obstacles to high-performance micro-drilling especially for holes with large depth-to-diameter ratios. This paper offers the first study of the chip adhesion characteristics and formation mechanisms seen when micro-drilling ceramic particle-filled GFRP components, which is the substrate material of PCBs. A direct-contact temperature measurement method is presented to measure the temperatures seen when drilling the laminated composite material. The effects of processing parameters on drilling temperatures and chip adhesion were investigated. A method to control chip adhesion is suggested. The results show that chip adhesion can be divided into four stages. Effective measures to reduce chip adhesion include reducing the drill speed, appropriately increasing the feed rate, and, controlling the number of drilled holes before the drill is sharpened. Also, the use of cold forced air can aid heat dissipation and effective chip extraction. As a result, the chip adhesion was reduced.