A new sacrificial layer process for the fabrication of micromechanical systems
A new sacrificial layer process for the fabrication of micromechanical systems
复制标题
用于制造微机械系统的新牺牲层工艺
DOI：
10.1088/0960-1317/7/3/012
复制
发表时间：
1997
影响因子：
2.3
通讯作者：
R. Lawes
中科院分区：
文献类型：
--
作者：
Z. Cui;R. Lawes
发展了一种利用光刻胶作为牺牲层来制造微机械元件和系统的新工艺。通常使用的光致抗蚀剂被旋涂在衬底上作为牺牲层，并通过掩模对准器进行图案化。通过图案化第二层厚光致抗蚀剂并在光致抗蚀剂牺牲层的顶部上电镀来构建独立式金属结构。采用新型光刻胶牺牲层技术制作了静电微执行器和微电机。与现有的所有牺牲层技术相比，新工艺中使用的光刻胶易于涂覆，易于溶解，涉及的工艺步骤较少。该工艺与现有微加工技术中使用的大多数材料和工艺兼容。利用光致抗蚀剂作为牺牲层，微机械系统的制造变得简单和便宜得多。
A new process using photoresists as sacrificial layers has been developed to fabricate micromechanical components and systems. Commonly used photoresists are spun on a substrate as a sacrificial layer and patterned by a mask aligner. Free-standing metal structures are built by patterning a second layer of thick photoresist and electroplating on top of the photoresist sacrificial layer. Electrostatic microactuators and micromotors have been fabricated using the new photoresist sacrificial layer technique. Compared with all the existing sacrificial layer techniques, the photoresists used in the new process are easy to coat, easy to dissolve and less process steps are involved. The process is compatible with most of the materials and processes used in existing microfabrication technology. The fabrication of micromechanical systems becomes much simpler and cheaper with the use of a photoresist as a sacrificial layer.