Miniaturized Flexible Interdigital Sensor for In Situ Dielectric Cure Monitoring of Composite Materials
Miniaturized Flexible Interdigital Sensor for In Situ Dielectric Cure Monitoring of Composite Materials
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DOI：
10.1109/jsen.2014.2309172
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发表时间：
2014-07-01
影响因子：
4.3
通讯作者：
Lang, Walter
中科院分区：
文献类型：
--
作者：
Boll, Dmitriy;Schubert, Konstantin;Lang, Walter
本文介绍了一种基于交指结构的小型化柔性电容传感器的设计和制作，并将其嵌入碳纤维增强塑料中，用于测量制造过程中的固化程度。基板的灵活性使得使用传感器制造层压板成为可能。该阵列由1024个金电极组成，电极宽度和间距为3微米，形成18.4 mm(2)的有效面积。传感器的厚度可与碳纤维(细丝)的厚度相媲美。6微米的厚度仅略微中断了复合材料的交联性。传感器已经生产出来并嵌入其中。测量结果表明，该系统能够对聚合过程进行有效监控。
This paper presents the design and fabrication of a miniaturized flexible capacitive sensor based on interdigitated structures and its embedding in carbon fiber reinforced plastics to measure the degree of curing during manufacturing. The substrate's flexibility makes it possible to use the sensor to manufacture laminates. The array consists of 1024 gold electrodes with an electrode width and spacing of 3 mu m creating an active area of 18.4 mm(2). The sensor's thickness is comparable with the carbon fiber's (filaments') thickness. A thickness of 6 mu m interrupts the cross linking of the composite material only marginally. The sensor has been produced and embedded. Measurements confirm that it can effectively monitor the polymerization process.