Exploring Biofoam as a Material for Tangible Interaction

Exploring Biofoam as a Material for Tangible Interaction
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探索生物泡沫作为有形相互作用的材料

DOI:
10.1145/3532106.3533494
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发表时间:
2022
期刊:
Proceedings of the 2022 ACM Designing Interactive Systems Conference
影响因子:
--
通讯作者:
Laura Devendorf
Laura Devendorf
中科院分区:
--
文献类型:
--
作者:
Eldy S. Lazaro Vasquez;Netta Ofer;Shanel Wu;M. E. West;Mirela Alistar;Laura Devendorf

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每一种新开发的材料都为设计师提供了更广泛的美学和功能可能性。本文将数字交互系统(DIS)引入生物泡沫,这是一种水溶性、可生物降解且可导电的材料。我们详细描述了这种材料:从无到有制作该材料的过程,使用手工工艺将材料制作成各种形状,并介绍了生物泡沫在人机交互方面的两种具体应用。生物泡沫可以被煮制、塑形、分层、挤压、溶解或再次煮制,这为在设计过程中考虑材料的整个生命周期提供了可能性。我们提出了设计方面的考虑因素,以便设计师能够将生物泡沫“调整”到所需的质量,同时对生物泡沫的许多方面进行了特性描述,比如压缩性、回弹时间、透水性和导电性。最后,我们讨论了这种材料及其生命周期给设计和人机交互领域带来的独特机遇。
Each new material developed opens a broader pallet of aesthetic and functional possibilities for designers. This paper introduces DIS to biofoam, a material that is water-soluble, biodegradable, and can be made conductive. We describe the material in detail: the process of making the material from scratch, the material’s fabrication into forms with hand-craft techniques, and present two HCI specific applications of the biofoam. The biofoam can be cooked, molded, layered, extruded, dissolved or recooked opening up possibilities to consider the entire life cycle of the material in the design process. We contribute design considerations to allow designers to “tune” the biofoam to the desired quality, as well as a characterization of many aspects of the biofoam such as compression, spring back time, water permeability, and electrical conductivity. Finally, we discuss the unique opportunities this material and its life cycle bring to the design and HCI communities.
拆解:设计可拆卸的智能纺织品
DOI: 10.1145/3313831.3376227
发表时间: 2020
期刊: Proceedings of the 2020 CHI Conference on Human Factors in Computing Systems
影响因子: --
作者:
Wu, Shanel;Devendorf, Laura
通讯作者: Devendorf, Laura
DOI: 10.1145/3294109.3295653
发表时间: 2019-03
期刊: Proceedings of the Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction
影响因子: --
作者:
Szu-Yu Liu;Jeffrey Bardzell;Shaowen Bardzell
通讯作者: Szu-Yu Liu;Jeffrey Bardzell;Shaowen Bardzell