Customized Thinning of Silicon-based Neural Probes Down to 2 m.
Customized Thinning of Silicon-based Neural Probes Down to 2 m.
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DOI：
10.1109/embc44109.2020.9176523
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发表时间：
2020-07-01
期刊：
影响因子：
--
通讯作者：
Paul, Oliver
中科院分区：
文献类型：
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作者：
Otte, Elisabeth;Cziumplik, Valerian;Paul, Oliver
本文报道了使用深反应离子刻蚀（DRIE）作为后处理步骤的基于硅（Si）的神经探针的定制减薄。预期减小的穿刺针尺寸可最大限度地减少局部组织创伤，同时保证植入期间的穿刺针完整性。对于DRIE，探针被微加工的Si覆盖芯片部分地掩蔽，该覆盖芯片包括定制的腔，通过适当选择覆盖芯片设计和DRIE参数，分别实现任何期望的变薄长度l和探针厚度t。各种各样的探头设计实现了柄尖端厚度从35米下降到2米。所有探针均可成功植入脑组织体模中，表明插入力从未处理探针的0.55 mN显著降低至2 m细柄的0.08 mN。当硬脑膜由聚乙烯（PE）膜模拟时，对于15 m薄的柄，力从28.9 mN降低到16.6 mN。
This paper reports on the customized thinning of neural probes based on silicon (Si) using deep reactive ion etching (DRIE) as a post-processing step. The reduced probe dimensions are expected to minimize local tissue trauma, while guaranteeing probe integrity during implantation. For DRIE, the probes are partially masked by a micromachined Si cover chip comprising tailored cavities enabling any desired thinned length l and probe thickness t by a proper choice of cover chip design and DRIE parameters, respectively. A broad variety of probe designs were realized with shank tip thicknesses ranging from 35 m down to 2 m. All probes could successfully be implanted into a brain tissue phantom, demonstrating a pronounced reduction in insertion force from 0.55 mN for unprocessed probes to 0.08 mN for 2-m-thin shanks. When the dura mater was mimicked by a polyethylene (PE) membrane, forces were reduced from 28.9 mN to 16.6 mN for 15-m-thin shanks.