ReSiPI: A Reconfigurable Silicon-Photonic 2.5D Chiplet Network with PCMs for Energy-Efficient Interposer Communication

ReSiPI: A Reconfigurable Silicon-Photonic 2.5D Chiplet Network with PCMs for Energy-Efficient Interposer Communication
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DOI:
10.1145/3508352.3549432
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发表时间:
2022-08
期刊:
2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD)
影响因子:
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通讯作者:
Ebadollah Taheri;S. Pasricha;M. Nikdast
Ebadollah Taheri;S. Pasricha;M. Nikdast
中科院分区:
其他
文献类型:
--
作者:
Ebadollah Taheri;S. Pasricha;M. Nikdast

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2.5D小芯片系统已被提出用于提高大规模芯片的低制造良率。然而,通过电子中介层连接小芯片会给中介层网络带来高通信负载。硅光子技术在处理芯片内片上网络(NoC)结构中的大量通信且保持低延迟方面展现出巨大潜力。尽管硅光子器件的最新进展已将光子NoC扩展到能够在2.5D小芯片系统中实现高带宽通信,但这种基于中介层的光子网络仍然存在高功耗问题。在这项工作中,我们设计并分析了一种新型的可重构节能且拥塞感知的硅光子2.5D中介层网络,称为ReSiPI。考虑到运行时的通信流量,ReSiPI能够动态部署小芯片间的光子网关以改善整体网络拥塞情况。ReSiPI还采用基于相变材料(PCMs)的开关元件来动态重构光子中介层网络并对其进行电源门控,从而提高网络的功率效率。与之前最先进的2.5D光子网络相比,ReSiPI在网络中平均延迟降低了37%,功耗降低了25%,能耗最小化达到53%。
2.5D chiplet systems have been proposed to improve the low manufacturing yield of large-scale chips. However, connecting the chiplets through an electronic interposer imposes a high traffic load on the interposer network. Silicon photonics technology has shown great promise towards handling a high volume of traffic with low latency in intra-chip network-on-chip (NoC) fabrics. Although recent advances in silicon photonic devices have extended photonic NoCs to enable high bandwidth communication in 2.5D chiplet systems, such interposer-based photonic networks still suffer from high power consumption. In this work, we design and analyze a novel Reconfigurable power-efficient and congestion-aware Silicon-Photonic 2.5D Interposer network, called ReSiPI. Considering run- time traffic, ReSiPI is able to dynamically deploy inter-chiplet photonic gateways to improve the overall network congestion. ReSiPI also employs switching elements based on phase change materials (PCMs) to dynamically reconfigure and power-gate the photonic interposer network, thereby improving the network power efficiency. Compared to the best prior state-of-the-art 2.5D photonic network, ReSiPI demonstrates, on average, 37% lower latency, 25% power reduction, and 53% energy minimization in the network.