Effect of 2,2'-dipyridine on borate-buffered electroless copper deposition
Effect of 2,2'-dipyridine on borate-buffered electroless copper deposition
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发表时间：
2003
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通讯作者：
Show-Chin Kou;A. Hung
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作者：
Show-Chin Kou;A. Hung
Electroless copper plating is an important process in the fabrication of high density multilayer printed circuit boards (PCB). Recent developments in electroless copper plating have focused on increasing the deposition rate and decreasing the deposit electrical resistivity. We have previously reported a high deposition rate for an electroless copper plating solution containing a borate buffer. 1 However, the deposits from these solutions were rough, with large grains and high electrical resistivity. Herein, the use of a 2,2'-dipyridine additive was studied toward the goal of improving the quality of the deposit.
