Ultra‐Thin Ceramic Substrates for Improved Heat sinking for MicroLEDs
Ultra‐Thin Ceramic Substrates for Improved Heat sinking for MicroLEDs
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DOI：
10.1002/admt.202300390
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发表时间：
2023-08
影响因子：
6.8
通讯作者：
Christine K. McGinn;Vikrant Kumar;Megan Noga;Zachary A. Lamport;Ioannis Kymissis
中科院分区：
文献类型：
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作者：
Christine K. McGinn;Vikrant Kumar;Megan Noga;Zachary A. Lamport;Ioannis Kymissis
微型发光二极管（MicroLED）提供无与伦比的亮度和工作寿命，这导致了显示器和非显示器应用设备的大量使用。然而，微发光二极管的小尺寸和高功率密度会导致不利的加热效应增加，从而限制性能。提出了新一代电绝缘高导热材料，如氧化铝，以减轻这些热效应时，用作基板作为玻璃的替代品。然后，该策略可以用作被动散热的方法，以提高microLED的整体性能。在这项工作中，一种新的可用材料，80微米厚的氧化铝陶瓷基板，显示出产生平均30%的改善，在玻璃基板的最大电流驱动。
Micro light emitting diodes (MicroLEDs) provide unrivaled luminance and operating lifetime, which has led to significant activity using devices for display and non‐display applications. The small size and high power density of microLEDs, however, causes increased adverse heating effects that can limit performance. A new generation of electrically insulating high thermal conductivity materials, such as alumina, is proposed to mitigate these thermal effects when used as a substrate as an alternative to glass. This strategy can then be used as a method of passive heat sinking to improve the overall performance of the microLED. In this work, a newly available material, an 80 micron thick alumina ceramic substrate, is shown to yield a 30 % improvement on average in the maximum current drive over a glass substrate.