Surface characterization of diamond films polished by thermomechanical polishing method

Surface characterization of diamond films polished by thermomechanical polishing method
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DOI:
10.1016/0040-6090(95)08157-7
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发表时间:
1996-06
期刊:
影响因子:
2.1
通讯作者:
Si-Kyung Choi;D. Jung;S. Kweon;S. Jung
Si-Kyung Choi;D. Jung;S. Kweon;S. Jung
中科院分区:
材料科学3区
文献类型:
--
作者:
Si-Kyung Choi;D. Jung;S. Kweon;S. Jung

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