A supramolecular hydrogen-bonded network as a diffusion barrier for metal adatoms.

A supramolecular hydrogen-bonded network as a diffusion barrier for metal adatoms.
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作为金属吸附原子扩散势垒的超分子氢键网络。

DOI:
10.1002/anie.200806267
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发表时间:
2009
期刊:
Angewandte Chemie (International ed. in English)
影响因子:
--
通讯作者:
Silien C
Silien C
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--
文献类型:
--
作者:
Silien C

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The versatility and precision afforded by molecular structures make surface-based supramolecular self-assembly a promising strategy for addressing the lower end of the nanoscale.[1, 2] Whereas precisely defined patterns can be straightforwardly generated, subsequent modification, such as functionalization, secondary patterning, or macroscopic interfacing, is required for such structures to become useful. One critical issue is thus the compatibility of supramolecular structures with further modification steps. Moreover, mechanisms determining processes on a larger scale are not expected to apply at the length scale of supramolecular structures because the reduced dimensionality alters the kinetics of processes and changes the influence of energy-determining factors. From these two points, it is evident that the development of self-assembled nanostructures requires the establishment of routes towards higher levels of complexity and understanding of the underlying mechanisms.First steps along the aforementioned directions have been taken by demonstrating that porous supramolecular structures can be used as templates to control arrangement of other molecules, such as C60,[3–5] coronene,[6] or porphyrins.[4] Following this scheme, a hybrid structure, combining a network with self-assembled monolayers (SAMs), was demonstrated recently.[7] A supramolecular hydrogen-bonded network composed of PTCDI and melamine was first formed on a Au (111) surface and thiols, such as w-(4оmethylbiphenyl-4-yl) ethanethiol (BP2), were adsorbed into its pores (Figure 1). As SAMs allow very flexible tailoring of interfaces,[8, 9] such network/SAM hybrid structures potentially allow versatile and precise chemistry at the nanoscale and thus warrant further exploration. Given the opportunities afforded by potential-controlled processing, our interest lies in metal electrodeposition and herein we focus on the underpotential deposition (UPD) of copper. UPD involves deposition of one to two monolayer (s) of a metal onto a foreign metal substrate and occurs positive of the Nernst potential.[10] Beside the fact that it precedes bulk deposition, it also enables modification of SAMs by intercalation at the SAM–substrate interface, which alters the thiol–substrate bond and thus enhances SAM stability. This effect can be
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DOI: 10.1002/(sici)1521-396x(199905)173:1
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