Effect of Ambient Temperature on Stress Measurement Method Using Copper Foil
Effect of Ambient Temperature on Stress Measurement Method Using Copper Foil
复制标题
环境温度对铜箔应力测量方法的影响
作者：
Y. Ono;S. Morito
电镀铜的应力测量方法是利用机械元件上的铜的晶粒生长情况进行反复载荷的测量。由于这种生长也是由热能引起的，因此研究了环境温度对晶粒生长密度和晶粒取向的影响。在293 ~ 353 K的温度下进行了循环扭转试验。建立了晶粒生长密度与最大剪切应力、循环次数和环境温度之间的关系，以测量机械元件上发生的最大剪切应力。此外，还进行了循环弯曲-扭转试验，并用电子背散射衍射分析了生长晶粒的取向。在不同温度条件下，晶粒的滑移方向与剪切应力方向基本一致。这意味着在353 K以下的温度下，主应力可以通过使用生长晶粒的极图或反极图来测量。
The copper electroplating stress measurement method uses the grain growth in the copper on a machine element that has been subjected to repeated loads. Because this growth is also caused by thermal energy, the effect of the ambient temperature on grain growth density and grain orientation was investigated. Cyclic torsion tests were carried out at temperatures from 293 to 353 K. The relationship among the grain growth density, maximum shear stress, number of cycles, and ambient temperature was formulated to measure the maximum shear stress occurring on the machine element. Moreover, cyclic bending–torsion tests were also performed, and the orientations of grown grains were analysed by electron backscatter diffraction. The slip directions of grown grains corresponded closely with the direction of shear stress in spite of the ambient temperatures. This means that principal stresses can be measured by using the pole figure or the inverse pole figure of grown grains at temperatures up to 353 K.