Improved step stress accelerated life testing method for electronic product

Improved step stress accelerated life testing method for electronic product
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DOI:
10.1016/j.microrel.2012.04.003
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发表时间:
2012
期刊:
Microelectron. Reliab.
影响因子:
--
通讯作者:
Qingchuan He;Wenhua Chen;Jun Pan;Ping Qian
Qingchuan He;Wenhua Chen;Jun Pan;Ping Qian
中科院分区:
其他
文献类型:
--
作者:
Qingchuan He;Wenhua Chen;Jun Pan;Ping Qian

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