Design and Simulation of 3D Layout for MID Based on Open CASCADE
Design and Simulation of 3D Layout for MID Based on Open CASCADE
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DOI：
10.4028/www.scientific.net/amr.479-481.1978
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发表时间：
2012-02
期刊：
影响因子：
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通讯作者：
Yong Zhuo;Y. Wu;Juan Peng
中科院分区：
文献类型：
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作者：
Yong Zhuo;Y. Wu;Juan Peng
模压互连器件（MID）是一种抛弃传统电路板，直接在材料上集成机械和电子功能的创新技术。由于工艺复杂，现有的MCAD和ECAD已不能满足MID的要求，因此本文开发了一个基于Open CASCADE的MID三维布图设计与仿真原型系统。通过对三维自动布线算法的研究，实现了三维电子元器件的布局和三维自动布线功能。在研究MID制造工艺的基础上，实现了基于六轴机器人的电子元器件三维激光直接成型和贴装仿真。
Molded Interconnect Devices (MID) is an innovative technology which abandoned the conventional board and integrates the mechanical and electronic functions directly on materials. Due to the complex process, the existing MCAD and ECAD do not meet the requirements of MID, so an MID prototype system for design and simulation of 3D layout based on Open CASCADE has been developed in this paper. Through studying on the algorithm of 3D automatic routing, realized the functions of placement of 3D electronic components and 3D automatic routing. Also, simulation for 3D laser direct structuring and placement of electronic components with a six-axis robot has come true after studying manufacturing process of MID.