Improving Conductivity of 3D Printed Conductive Pastes for RF & High Performance Electronics
Improving Conductivity of 3D Printed Conductive Pastes for RF & High Performance Electronics
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提高射频 3D 打印导电浆料的导电性
DOI：
10.1109/imws-amp.2018.8457162
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发表时间：
2018
期刊：
影响因子：
--
通讯作者：
E. Forsythe
中科院分区：
文献类型：
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作者：
S. Hawasli;H. Tsang;N. Lazarus;G. Smith;E. Forsythe
3D打印导线的低导电性是成功3D打印电子产品的主要障碍之一。这些低电导率导致有损传输线、性能差的天线，并且从电路设计的角度提出了许多挑战。在这项工作中，演示了两种技术来提高3D打印银浆料的导电性：光子烧结和选择性电镀。将银线直接写入挤出到FFF 3D打印基底上并在固化之前干燥。作为传统热固化的替代方案，在单轴双倾斜3D表面上打印的部件使用商业PulseForge系统进行光子烧结，从而使线电导率提高了806%。然后在镀铜溶液中对线路进行电镀，选择性地沉积一层铜，从而使线路电导率进一步提高886%，总提高7,150%。使用4点测量装置沿着与X射线CT扫描系统一起验证线电导率，以确定线的横截面积。使高分辨率3D打印金属线更接近体电导率对于实现3D打印RF和高性能电子产品至关重要。
The low conductivity of 3D printed conductive lines is one of the main obstacles in successful 3D printed electronics. These low conductivities lead to lossy transmission lines, poorly performing antennas, and pose many challenges from a circuit design prospective. In this work, two techniques are demonstrated for improving the conductivity of 3D printed silver paste: photonic sintering and selective electroplating. The silver lines were direct write extruded onto a FFF 3D printed substrate and dried before curing. As an alternative to traditional heat curing, parts printed on a uniaxial double sloped 3D surface are photonically sintered using a commercial PulseForge system, resulting in an increase of the line conductivity by 806%. The lines were then electroplated in a copper plating solution, selectively depositing a layer of copper to obtain a further increase in the line conductivity of 886%, a total improvement of 7,150%. Line conductivities were verified using a 4-point measurement setup along with an X-Ray CT scanning system to determine the cross sectional area of the lines. Bringing high resolution 3D printed metal lines closer to bulk conductivities is critical in enabling 3D printed RF and high performance electronics.