Inhibition of copper corrosion in sodium nitrate solutions with nontoxic inhibitors
Inhibition of copper corrosion in sodium nitrate solutions with nontoxic inhibitors
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DOI：
10.1016/j.corsci.2008.02.015
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发表时间：
2008-06
影响因子：
8.3
通讯作者：
M. Scendo
中科院分区：
文献类型：
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作者：
M. Scendo
本文研究了嘌呤（PU）和腺嘌呤（AD）浓度对铜在0.5MNaNO_3溶液（pH3.0）中腐蚀和自然溶解的影响。调查涉及电化学极化方法和重量测量，以及石英晶体微天平（QCM）技术和扫描显微镜（SEM）。缓蚀效率随PU和AD浓度的增加而增加。假设抑制剂的粘附层解释了保护作用。缓蚀剂在铜表面的吸附符合Langmuir吸附等温式。标准吸附自由能值表明PU和AD在铜表面的化学吸附。
The influence of the concentration of purine (PU) and adenine (AD) on the corrosion and spontaneous dissolution of copper in 0.5M NaNO3solutions of pH 3.0 was studied. The investigations involved electrochemical polarization methods and gravimetric measurements as well as quartz crystal microbalance (QCM) techniques and scanning microscopy (SEM). The inhibition efficiency increases with an increase in the concentration of PU and AD. Adherent layers of inhibitors were postulated to account for the protective effect. The adsorptions of inhibitors were found to occur on the surface of copper according to the Langmuir isotherm. The values of standard free energies of adsorption suggest the chemical adsorption of PU and AD on the copper surface.