Robust design of CMOS wireless SoC for 3D-integrated small transferjet™ module
Robust design of CMOS wireless SoC for 3D-integrated small transferjet™ module
复制标题
用于 3D 集成小型 Transferjet™ 模块的 CMOS 无线 SoC 的稳健设计
DOI：
10.1109/rfit.2015.7377881
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发表时间：
2015
期刊：
影响因子：
--
通讯作者：
M. Okano
中科院分区：
文献类型：
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作者：
K. Agawa;I. Seto;D. Miyashita;M. Okano
TransferJet™是一种新兴的高速近距离无线通信标准，可以在几厘米的传输范围内实现高达522 Mbps的数据传输。我们设计了一款全集成TransferJetTM SoC，工作频率为4.48 GHz，信号带宽为560 MHz，采用65 nm CMOS工艺。还开发了一个采用3D集成技术的模块。将带有射频和数字基带电路的SoC嵌入到模块的有机树脂基板中，实现了4.8 mm×4.8 mm×1.0 mm的模块尺寸。由于射频信号对低高度和小体积的模块非常敏感，我们提出了一种波形预加重方案来处理超宽带，并在SoC的发射机中设计了可编程的功率衰减器来精确输出功率，以满足TransferJetTM标准。
TransferJet™ is an emerging high-speed close-proximity wireless communication standard, which enables a data transfer of up to 522 Mbps within a few centimeters transmission range. We have designed a fully integrated TransferJetTM SoC with a 4.48-GHz operating frequency and a 560-MHz signal bandwidth using a 65 nm CMOS technology. A module has also been developed employing 3D integration technology. The SoC with RF and digital baseband circuits is embedded in an organic resin substrate of the module to achieve a module size of 4.8 mm × 4.8 mm × 1.0 mm. Since RF signals are sensitive to the low height and small footprint of the module, we propose a waveform pre-emphasis scheme to handle the ultra-wide bandwidth and a programmable power attenuator for precise output power in the transmitter of the SoC to meet the TransferJetTM standard.