Transparent Conductive Metal Thin-Film Electrodes Structured by Direct Laser Interference Patterning
Transparent Conductive Metal Thin-Film Electrodes Structured by Direct Laser Interference Patterning
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DOI：
10.1002/adem.201400454
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发表时间：
2015-08-01
影响因子：
3.6
通讯作者：
Leo, Karl
中科院分区：
文献类型：
--
作者：
Mueller-Meskamp, Lars;Schubert, Sylvio;Leo, Karl
Thin, transparent silver films sandwiched between dielectric layers are a versatile and high performance transparent electrode technology. Using direct laser interference patterning (DLIP), we are able to structure thin metal films by direct ablation in a fast, single step process. To achieve beneficial pattern and ablation properties, different sublayers of MoOx, Au, Al, Cr, or organics below the silver film and different laser power densities and pulse numbers are investigated. The resulting hexagonally periodic array of apertures shows improved transmittance and sheet resistance. For the best parameter set, the silver network contains little superfluous material at the joints and benefits from partial recrystallization, improving the conductivity. The nanostructured thin-films have great potential to be combined with dielectric antireflection layers as transparent electrode for any thin-film optoelectronic devices.
