Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification
Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification
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DOI：
10.1109/tpel.2011.2160988
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发表时间：
2012
影响因子：
6.7
通讯作者：
D. Xiang;L. Ran;P. Tavner;Shaoyong Yang;A. Bryant;Philip A. Mawby
中科院分区：
文献类型：
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作者：
D. Xiang;L. Ran;P. Tavner;Shaoyong Yang;A. Bryant;Philip A. Mawby
状态监测功率半导体器件可以通知转换器的维护和减少损坏。本文提出了一种通过检测逆变器输出谐波的变化来监测电压源逆变器绝缘栅双极晶体管电源模块焊料疲劳的方法。结果表明，由非理想开关引起的低次谐波受器件结温的影响，而结温又取决于模块的焊接条件。为了提高对该现象的检测精度，将逆变器控制器设置为在目标谐波频率处引起谐波谐振。潜在的共振由外部控制回路抑制，控制动作可以用作状态监测信号。通过仿真和实验验证了该方法的有效性，并对其运行性能进行了评价。
Condition monitoring power semiconductor devices can inform converter maintenance and reduce damage. This paper presents a method to monitor solder fatigue in a voltage source inverter insulated gate bipolar transistor power module by detecting the change of an inverter output harmonic. It is shown that low-order harmonics, caused by nonideal switching, are affected by the device junction temperature, which in turn depends upon module solder condition. To improve the detection accuracy of the phenomenon, the inverter controller is set to cause harmonic resonance at the target harmonic frequency. The would-be resonance is suppressed by an outer control loop where the control action can be used as the condition monitoring signal. Simulation and experiment are presented to validate the method and evaluate its performance in operation.