New fatigue damage evaluation of MEMS materials under tension-compression cyclic loading
New fatigue damage evaluation of MEMS materials under tension-compression cyclic loading
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DOI：
10.1109/memsys.2005.1453962
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发表时间：
2005-07
期刊：
影响因子：
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通讯作者：
Y. Isono;H. Kito;T. Kikuchi;T. Shimazu;M. Katayama
中科院分区：
文献类型：
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作者：
Y. Isono;H. Kito;T. Kikuchi;T. Shimazu;M. Katayama
研制了一种用于MEMS材料循环疲劳损伤评估的全反向弯曲疲劳试验机。本论文的重点是; 1）微型疲劳试验机的设计; 2）弯曲疲劳试验程序的建立; 3）微尺度单晶硅（SCS）试样的疲劳寿命揭示。在疲劳测试中，SCS样本在双厚杠杆之间往复运动，以在样本的两个固定端产生拉伸和压缩应力。双杠杆起着两个作用;一个是作为弯曲压头，另一个是作为施加到试样上的循环载荷的检测器。使用基于AFM技术的激光反射系统，通过双杠杆的偏转来测量弯曲载荷。本研究成功地获得了微尺度试件的弹性滞回曲线。
A novel full-reversed bending fatigue tester was developed for cyclic fatigue damage evaluation of MEMS materials. This paper focuses on; 1) the design of the micro fatigue tester; 2) establishment of the bending fatigue testing procedure; and 3) revealing fatigue lives of microscale single crystal silicon (SCS) specimens. In fatigue testing, an SCS specimen was reciprocated between the twin thick-cantilevers to induce tensile and compressive stresses at both fixed ends of the specimen. The twin cantilevers played two roles; one is as an indenter for bending and the other as a detector of cyclic loading applied to a specimen. The bending load was measured by the deflection of the twin cantilevers using a laser reflection system based on an AFM technique. This research succeeded in obtaining elastic hysteresis loops of microscale specimen.