Modeling methodology of the conducted emission of a DC-DC converter board
Modeling methodology of the conducted emission of a DC-DC converter board
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DC-DC 转换器板传导发射的建模方法
DOI：
10.1109/emccompo.2017.7998085
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发表时间：
2017
期刊：
影响因子：
--
通讯作者：
M. A. Sentis
中科院分区：
文献类型：
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作者：
A. Boyer;Manuel Antero;Gonzalez Sentis;C. Ghfiri;A. Durier;Modeling;M. A. Sentis
本文提出了一种根据自下而上的方法对电子板进行建模的方法。该方法用于建立同步降压 DC-DC 转换器板的模型，用于传导发射预测。描述了选择模型端子以及组件和 PCB 互连模型的构造的不同步骤。
This paper proposes a methodology to model an electronic board according to a bottom-up approach. This method is applied to build the model of a synchronous buck DC-DC converter board for conducted emission prediction purpose. The different steps to select the model terminals and the construction of the component and PCB interconnect models are described.