Inductive power link for a wireless cortical implant with biocompatible packaging
Inductive power link for a wireless cortical implant with biocompatible packaging
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DOI：
10.1109/icsens.2010.5690844
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发表时间：
2010-11
期刊：
影响因子：
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通讯作者：
K. M. Silay;C. Dehollain;M. Declercq
中科院分区：
文献类型：
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作者：
K. M. Silay;C. Dehollain;M. Declercq
本文介绍了一种用于皮质植入物的感应电源链路。该链路包括E类功率放大器、电感链路、匹配网络和整流器。感应链路的线圈针对10 mm的距离（头皮厚度）进行了设计和优化。功率放大器被设计为允许通过控制电源电压来进行闭环功率控制。提出了一种新的包装拓扑结构，以便将植入物定位在颅骨中，而不占用太多面积，但仍然获得远程供电线圈之间的短距离。该封装采用生物相容性材料（如PDMS和Parylene-C）制造，包括次级线圈、匹配网络和整流器。该链路的功率效率的特征在于宽范围的负载功率（1- 20 mW），并且发现对于10 mW的标称负载为8.1%。与没有匹配网络的链路相比，匹配网络在整个范围上提高了功率效率。
This article presents an inductive power link for a cortical implant. The link includes a Class-E power amplifier, an inductive link, a matching network, and a rectifier. The coils of the inductive link are designed and optimized for a distance of 10mm (scalp thickness). The power amplifier is designed in order to allow closed loop power control by controlling the supply voltage. A new packaging topology is proposed in order to position the implant in the skull, without occupying much area, but still obtaining short distance between the remote powering coils. The package is fabricated using biocompatible materials such as PDMS and Parylene-C, and it includes the secondary coil, the matching network, and the rectifier. The power efficiency of the link is characterized for a wide range of load power (1–20mW) and found to be 8.1% for nominal load of 10mW. The matching network improves the power efficiency on the whole range, compared to the link without the matching network.