Effects of parasitic parameters on electromagnetic interference of power electronic modules
Effects of parasitic parameters on electromagnetic interference of power electronic modules
复制标题
寄生参数对电力电子模块电磁干扰的影响
DOI：
--
复制
发表时间：
2017
期刊：
影响因子：
--
通讯作者：
S. Ang
中科院分区：
文献类型：
--
作者：
A. Dutta;S. Ang
由于对快速和高频开关的需求日益增加，电磁干扰(EMI)是现代宽带隙(WBG)电力电子模块所关注的问题。本文研究了碳化硅功率器件通断时寄生振铃引起的电磁干扰问题。为了说明寄生优化的必要性，以减少开通和关断时的EMI，考虑了具有由两个并联的碳化硅功率器件组成的单个开关位置的线接式和无线式功率模块。与线结电源模块相比，无线键合电源模块具有更低的寄生电感。因此，对于减少辐射EMI的无线连接电源模块，接通和关断振铃显著减少。为了测量传导EMI，制作了线键合和无线键合功率模块，并对其进行了表征。无线键合电源模块在辐射和传导频率范围内都具有较好的电磁兼容性。
Electromagnetic interference (EMI) is a concern for modern day wide bandgap (WBG) power electronic modules due to the increasing demand for fast and high frequency switching. In this paper, EMI issues due to parasitic ringing at turn-on and turn-off of silicon carbide (SiC) power devices are investigated. To illustrate the need for parasitic optimization to reduce EMI at turn-on and turn-off, wire bonded and wire bondless power modules with a single switching position consisting of two SiC power devices connected in parallel are considered. The wire bondless power modules exhibit lower parasitic inductances compared to wire bonded power modules. As such, the turn-on and turn-off ringing is significantly reduced for the wire bondless power module yielding reduced radiated EMI. To measure the conducted EMI, wire bonded and wire bondless power modules are fabricated and characterized. The wire bondless power modules are shown to have better electromagnetic compatibility at both radiated and conducted frequency range.