High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed
High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed
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DOI：
10.1109/ectc.2007.373994
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发表时间：
2007-06
期刊：
影响因子：
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通讯作者：
F. Song;S. Lee;K. Newman;B. Sykes;S. Clark
中科院分区：
文献类型：
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作者：
F. Song;S. Lee;K. Newman;B. Sykes;S. Clark
本研究比较了使用Sn4.0%Ag0.5%Cu焊球和ENIG或OSP封装基板表面光洁度的BGA封装的高速键合测试（剪切和拉力）与板级跌落测试（BLDT）。在不同速度下进行高速剪切和拉伸试验;记录失效模式以及力和断裂能数据。此外，对剪切和拉伸试验样本的脆性断裂失效的两个互补表面（球和垫）进行了详细的显微镜分析（SEM和EDX）。这些研究的结果表明，与相同包装的BLDT过程中产生的脆性断裂的结果非常相似。此外，有很强的相关性之间的各种粘结试验参数，在脆性断裂发生和下降到失败的BLDT看到的数量。总之，建议在高速粘结测试中获得的脆性断裂是BLDT行为的强有力指标。
This study compares high-speed bondtesting (shear and pull) with board level drop testing (BLDT) of BGA packages using Sn4.0%Ag0.5%Cu solder balls and either an ENIG or OSP package substrate surface finish. High-speed shear and pull testing were carried out at various speeds; failure modes were recorded, together with force and fracture energy data. In addition, detailed microscopic analysis (SEM and EDX) was executed on both complementary surfaces (ball and pad) of brittle fracture failures from both shear and pull test samples. The results of these studies showed close similarity to those from brittle fractures generated during BLDT of the same packages. Furthermore, there was strong correlation between various bondtesting parameters at which brittle fractures occurred and the number of drops to failure seen in BLDT. In summary, it is suggested that brittle fractures obtained in high-speed bondtesting are a strong indicator of BLDT behavior.