Packaging of Ultrathin Flexible Magnetic Field Sensors With Polyimide Interposer and Integration in an Active Magnetic Bearing
Packaging of Ultrathin Flexible Magnetic Field Sensors With Polyimide Interposer and Integration in an Active Magnetic Bearing
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DOI：
10.1109/tcpmt.2019.2953830
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发表时间：
2020-01-01
影响因子：
2.2
通讯作者：
Zerna, T.
中科院分区：
文献类型：
--
作者：
Ernst, Daniel;Faghih, M.;Zerna, T.
超薄传感器使各种示波器能够在受限的几何形状中测量信号。一个示例是在主动磁轴承（AMB）中使用磁场传感器。在这里，薄传感器将允许直接测量AMB的转子和定子之间的气隙中的磁通量，这允许更快且更精确地控制AMB。这也导致AMB的更高刚度。因此，传感器必须薄于150\mu\text{m}$。在这篇文章中，以前的经验与聚酰亚胺和硅基霍尔传感器依赖于薄铋膜，实现了可靠的传感器与适当的互连技术。特别是与硅插入层一起使用的粘合剂倒装芯片技术，必须适应和优化聚酰亚胺基传感器的封装。通过特殊的测试设计设置，对技术和材料进行了优化。随后，制造了工作传感器系统。这些传感器显示出非常有前途的结果，并可以成功地集成到电磁轴承设置的初步测试。
Ultrathin sensors enable various scopes for measuring signals in restricted geometries. One example is the use of magnetic field sensors in active magnetic bearings (AMBs). Here, the thin sensor will allow measuring the magnetic flux directly in the air gap between the rotor and the stator of the AMB, which allows controlling the AMB faster and more precisely. This also results in a higher stiffness of the AMB. Therefore, the sensor has to be thinner than $150\mu \text{m}$ . In this article, previous experiences with polyimide- and silicon-based Hall sensors which rely on thin bismuth films were used to realize a reliable sensor with suitable interconnection technologies. Especially the adhesive flip-chip technology, which was used with silicon interposers, has to be adapted and optimized for the packaging of polyimide-based sensors. The technologies and the materials were optimized for this approach with a special test design setup. Afterward, the working sensor systems were manufactured. These sensors show very promising results and could be successfully integrated into an AMB setup for preliminary tests.