Multifunction cavitation technology to improve the surface function of Al – Cu alloy

Multifunction cavitation technology to improve the surface function of Al – Cu alloy
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DOI:
10.1016/j.ijlmm.2018.12.001
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发表时间:
2019-03
影响因子:
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通讯作者:
Masataka Ijiri;Daichi Shimonishi;S. Tani;Norihiro Okada;Masato Yamamoto;D. Nakagawa;Kumiko Tanaka;T. Yoshimura
Masataka Ijiri;Daichi Shimonishi;S. Tani;Norihiro Okada;Masato Yamamoto;D. Nakagawa;Kumiko Tanaka;T. Yoshimura
中科院分区:
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文献类型:
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作者:
Masataka Ijiri;Daichi Shimonishi;S. Tani;Norihiro Okada;Masato Yamamoto;D. Nakagawa;Kumiko Tanaka;T. Yoshimura

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多功能空化技术结合了超声空化技术和水射流喷丸技术。在这种加工技术中,据报道,提高纯Al表面上的疲劳强度所需的残余应力大,而通过这种加工的表面刮擦量小。此外,还报道了Al-Cu合金表面耐蚀性的改善。在这项研究中,为了提高效率和准确性的MFC技术,表面条件,残余应力和表面粗糙度的依赖关系,从水射流喷嘴(间隔距离)的距离试样表面进行了评估。当用带有旋流喷嘴的MFC(SFN-MFC)、带有SFN的WJP(SFN-WJP)和常规WJP处理Al-Cu合金试样时,当喷射距离为45 mm时,试样中心发生侵蚀,并且随着喷射距离的增加而减少。SFN-MFC、SFN-WJP和WJP分别在55、65和45 mm的间隔距离处达到最大压缩残余应力。残余应力与空蚀加工形成的空洞有关。在SFN-MFC中,在55和60 mm的间距处,空化气泡分别处于高压和高温状态。这些结果表明,高温和高压制度存在于MFC,在传统的WJP技术不同,和空化气泡的温度和压力取决于相隔距离。
Multifunction cavitation (MFC) combines ultrasonic cavitation technology and water jet peening (WJP) technology. In this processing technique, it has been reported that the residual stress necessary for improving the fatigue strength on the pure Al surface is large, whereas the amount of surface scraping by this processing is small. Moreover, improvement of the corrosion resistance of the surface of Al–Cu alloys has been reported. In this study, to improve the efficiency and accuracy of MFC technology, the dependence of the surface condition, residual stress, and surface roughness on the distance from the water jet nozzle (standoff distance) to the specimen surface were evaluated. When Al–Cu alloy specimens were processed by MFC with a swirl flow nozzle (SFN–MFC), WJP with an SFN (SFN–WJP), and conventional WJP, erosion at the center of the specimens occurred when the standoff distance was 45 mm and was reduced as the standoff distance was increased. The maximum compressive residual stress was reached at standoff distances of 55, 65, and 45 mm for SFN–MFC, SFN–WJP, and WJP, respectively. The residual stress was found to be correlated with voids formed by cavitation processing. In SFN–MFC, at standoff distances of 55 and 60 mm, the cavitation bubbles were in the high-pressure and high-temperature regimes, respectively. These results demonstrate that high-temperature and high-pressure regimes exist in MFC, unlike in conventional WJP technology, and the temperature and pressure in the cavitation bubbles depend on the standoff distance.