Ultra-high aspect ratio pores milled in diamond via laser, ion and electron beam mediated processes
Ultra-high aspect ratio pores milled in diamond via laser, ion and electron beam mediated processes
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DOI：
10.1016/j.diamond.2020.107806
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发表时间：
2020-05-01
影响因子：
4.1
通讯作者：
Bunn, Thomas L.
中科院分区：
文献类型：
--
作者：
Martin, Aiden A.;Bishop, James;Bunn, Thomas L.
微加工技术对于尖端材料的快速成型和应用开发至关重要。近年来，金刚石在量子光子学、生物传感、惯性约束聚变和磁强计等方面的应用引起了人们的极大兴趣。本文报道了用光子法、离子法和电子法对金刚石微孔进行超大长径比球磨的方法。采用多光子吸收激光烧蚀方法，在金刚石表面快速形成直径小于10微米、长径比为14：1的锥形微孔。在化学活性方面，氧聚焦离子束研磨可在钻石中产生高深宽比的气孔，长宽比为65：1，并且孔的长度上的锥度最小，克服了传统的镓基聚焦离子束研磨和激光烧蚀方法施加的物理相互作用体积限制。氧介导的电子束诱导刻蚀通过在后退表面直接引发化学反应，消除了聚焦离子束研磨中物理溅射机制的局限性，产生了200：1的高宽比。数值模拟揭示了氧聚焦离子束研磨和电子束诱导刻蚀方法优越的高宽比气孔研磨的物理基础。我们的结果展示了直接写入方法在钻石中制造超高纵横比微孔的方法，并提供了对这些物理过程的潜在机制的洞察。这里演示的三种方法可以根据所需的特征纵横比和工艺吞吐量互换应用。
Microfabrication techniques are critical for the rapid prototyping and development of applications for cutting edge materials. Recently diamond has gained considerable interest for quantum photonic, biosensing, inertial confinement fusion and magnetometer applications. In this article, ultra-high aspect ratio milling of diamond micropores by photon, ion and electron based methods is reported. A multiphoton absorption laser ablation approach is revealed to rapidly produce sub-10 mu m diameter micropores in diamond with an aspect ratio of 14:1 and a tapered profile at the surface interface. Chemically active, oxygen focused ion beam milling produces high-aspect ratio pores in diamond with an aspect ratio of 65:1 and minimal tapering over the length of the pore, overcoming the physical interaction volume limitations imposed in conventional gallium based focused ion beam milling and laser ablation methods. Oxygen-mediated electron beam induced etching is revealed to negate the limitations imposed by physical sputtering mechanisms utilized in focused ion beam milling via the direct initiation of chemical reactions at the receding surface, producing aspect ratios on the order of 200:1. Numerical simulations reveal the physical basis for the superior aspect-ratio pore milling of the oxygen focused ion beam milling and electron beam induced etching methods. Our results demonstrate direct-write methods for the fabrication of ultra-high aspect micropores in diamond and provide insight into the underlying mechanisms of these physical processes. The three methods demonstrated here can be interchanged for applications based on the desired characteristic aspect ratio and process throughput.