Stress Analysis of Shaft-Tube Bonded Joints Using a Variational Method
Stress Analysis of Shaft-Tube Bonded Joints Using a Variational Method
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采用变分法的轴管粘合接头应力分析
DOI：
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发表时间：
2010
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通讯作者：
J. Scanlan
中科院分区：
文献类型：
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作者：
Shaun S Kumar;J. Scanlan
功能模数梯度焊接线(FMGB)胶粘剂可用于焊接接头，以减少应力集中，从而获得更高的接头强度。本文提出了一种基于变分技术的轴管粘接接头应力分析框架，该变分方法使粘接系统的附加能量最小。这种圆柱形组件由相似或不同的粘合剂和FMGB粘合剂组成。研究了胶粘剂弹性模数的函数级配对胶层中峰值应力及其分布的影响。对具有不同模数分级曲线的接头进行了评估，并将结果与传统的单模胶结线(MMB)胶接接头进行了比较。应力分析表明，在相同的轴向拉伸载荷下，FMGB中的剥离应力和剪切峰值应力比MMB胶接接头的剥离应力和剪切峰值应力小得多，且沿粘接长度的分布更均匀。给出了数值算例，说明了几何和材料性质对粘结线中应力分布和强度的影响。此外，通过对胶粘剂的模数进行空间控制，可以获得最佳的接头剥离强度和剪切强度。
Functionally modulus graded bondline (FMGB) adhesives can be employed in bonded joints to reduce stress concentration and, hence, achieve higher joint strength. This study presents an analytical framework for the stress analysis of a shaft-tube bonded joint based on a variational technique which minimises the complimentary energy of the bonded system. This cylindrical assembly consists of similar or dissimilar adherends and a FMGB adhesive. The effect of functional grading of adhesive elastic modulus on the peak stresses and their distributions in the adhesive layer are studied. The joint with various modulus grading profiles is assessed and the results are compared with a conventional mono-modulus bondline (MMB) adhesive joint. Stress analysis indicates that the peel and shear peak stresses in the FMGB are much smaller and their distributions along bondlength are more uniform than those of MMB adhesive joints under the same axial tensile load. Numerical examples are provided to illustrate the effects of geometrical and material properties on the distributions and intensities of stresses in the bondline. Furthermore, optimal peel and shear strengths of the joint can be achieved by spatially controlling the modulus of the adhesive.