Effect of thione primers on adhesive bonding between an indirect composite material and Ag-Pd-Cu-Au alloy
Effect of thione primers on adhesive bonding between an indirect composite material and Ag-Pd-Cu-Au alloy
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DOI:
10.4012/dmj.2014-187
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发表时间:
2014-10-01
影响因子:
2.5
通讯作者:
Nikawa, Hiroki
中科院分区:
文献类型:
--
作者:
Imai, Hideyuki;Koizumi, Hiroyasu;Nikawa, Hiroki
The current study evaluated the effect of primers on the shear bond strength of an indirect composite material joined to a silver-palladium-copper-gold (Ag-Pd-Cu-Au) alloy (Castwell). Disk specimens were cast from the alloy and were air-abraded with alumina. Eight metal primers were applied to the alloy surface. A light-polymerized indirect composite material (Solidex) was bonded to the alloy. Shear bond strength was determined both before and after the application of thermocycling. Two groups primed with Metaltite (thione) and M. L. Primer (sulfide) showed the greatest post-thermocycling bond strength (8.8 and 6.5 MPa). The results of the X-ray photoelectron spectroscopic (XPS) analysis suggested that the thione monomer (MTU-6) in the Metaltite primer was strongly adsorbed onto the Ag-Pd-Cu-Au alloy surface even after repeated cleaning with acetone. The application of either the thione (MTU-6) or sulfide primer is effective for enhancing the bonding between a composite material and Ag-Pd-Cu-Au alloy.