High-resolution patterning of solution-processable materials via externally engineered pinning of capillary bridges.
High-resolution patterning of solution-processable materials via externally engineered pinning of capillary bridges.
复制标题
通过毛细管桥的外部工程固定的溶液处理材料的高分辨率模式。
DOI：
10.1038/s41467-018-02835-7
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发表时间：
2018-01-26
影响因子：
16.6
通讯作者：
Chu D
中科院分区：
文献类型：
--
作者：
Li S;Chun YT;Zhao S;Ahn H;Ahn D;Sohn JI;Xu Y;Shrestha P;Pivnenko M;Chu D
基于溶液可加工材料的电子学在许多领域有着广阔的应用前景，这激发了人们对液体干燥和图案形成的巨大研究兴趣。然而，通过液体工艺组装具有亚微米/纳米分辨率的结构是非常具有挑战性的。我们展示了一种简单的方法来快速生成具有大面积深亚微米尺寸特征的聚合物结构。在该方法中，溶液膜在具有槽/脊表面形貌的悬浮柔性模板下在基底上干燥。在溶剂蒸发时，溶液在凹槽中分裂并在模板和基底之间形成毛细桥，其被模板凹槽的边缘牢固地钉扎。这种沟槽钉扎使接触线稳定，从而允许形成用于制造各种功能材料和电子器件的具有高纵横比的精细图案化结构。我们还制作了次级自组装纳米条纹图案，其分辨率约为50 nm。溶液处理电子器件对于大规模电子器件是理想的，但是通过液体工艺制造纳米图案是具有挑战性的。Li等人使用具有凹槽和脊结构的软模具解决了这个问题，该软模具通过钉扎效应在染色时控制薄膜形态。
Electronics based on solution-processable materials are promising for applications in many fields which stimulated enormous research interest in liquid-drying and pattern formation. However, assembling of structure with submicrometre/nanometre resolution through liquid process is very challenging. We show a simple method to rapidly generate polymer structures with deep-submicrometre-sized features over large areas. In this method, a solution film is dried on a substrate under a suspended flexible template with groove/ridge surface topography. Upon solvent evaporation, the solution splits in the grooves and forms capillary bridges between the template and substrate, which are firmly pinned by the edges of the template grooves. This groove pinning stabilizes the contact lines, thereby allowing the formation of fine patterned structures with high aspect ratios which were used to fabricate various functional materials and electronic devices. We also produced secondary self-assembled nano-stripe patterns with resolutions of about 50 nm on the primary lines. Solution-processed electronics is desirable for large-scale electronics, but it is challenging to fabricate nanometre patterns via liquid processes. Li et al. address this problem using soft molds with groove and ridge structures, which control thin-film morphology upon dying via the pinning effect.
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