Thermal Simulations of Temperature Excursions on the Athena X-IFU Detector Wafer from Impacts by Cosmic Rays

Thermal Simulations of Temperature Excursions on the Athena X-IFU Detector Wafer from Impacts by Cosmic Rays
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Athena X-IFU 探测器晶圆因宇宙射线影响而产生的温度偏移的热模拟

DOI:
10.1007/s10909-020-02380-y
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发表时间:
2020
影响因子:
2
通讯作者:
den Hartog R.
den Hartog R.
中科院分区:
物理与天体物理3区
文献类型:
--
作者:
Stever S. L.;Peille P.;Bruijn M. P.;Roussafi A.;Lotti S.;Macculi C.;Janssen R. M. J.;den Hartog R.

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我们介绍了在COMSOL中开发的热模型的设计和实现,旨在探测L2宇宙射线撞击Athena X-IFU探测器晶片的实际速率和能量所产生的晶片级热响应。晶圆热模型是一个四层的2D模型,其中两层代表的组成材料(硅体和Si 3 N4膜)和两层代表的Au金属化层的声子和电子温度。我们的基础上的X-IFU探测器晶片和模拟宇宙射线的影响,使用一个简单的功率注入到硅体的当前规格的模拟几何形状。我们在仪器最中心的TES检测器处测量温度。通过探测系统的响应和脉冲特性作为热输入能量和位置的函数,我们在Python中重建宇宙射线脉冲。通过利用该代码,沿着为X-IFU生成的GEANT 4模拟结果,我们生成了中心TES所见温度的真实时序数据(TOD),我们使用该数据模拟该晶圆上类空间条件下仪器能量分辨率的退化。我们发现一个退化的能量分辨率为7 keV的X射线的0.04 eV。通过修改晶片参数和比较模拟的TOD,这项研究是一个有价值的工具,探测器看到的热背景上的设计变化。
We present the design and implementation of a thermal model, developed in COMSOL, aiming to probe the wafer-scale thermal response arising from realistic rates and energies of cosmic rays at L2 impacting the detector wafer of Athena X-IFU. The wafer thermal model is a four-layer 2D model, where two layers represent the constituent materials (Si bulk and Si3N4membrane) and two layers represent the Au metallization layer’s phonon and electron temperatures. We base the simulation geometry on the current specifications for the X-IFU detector wafer and simulate cosmic ray impacts using a simple power injection into the Si bulk. We measure the temperature at the point of the instrument’s most central TES detector. By probing the response of the system and pulse characteristics as a function of the thermal input energy and location, we reconstruct cosmic ray pulses in Python. By utilizing this code, along with the results of the GEANT4 simulations produced for X-IFU, we produce realistic time-ordered data (TOD) of the temperature seen by the central TES, which we use to simulate the degradation of the energy resolution of the instrument in space-like conditions on this wafer. We find a degradation to the energy resolution of 7 keV X-rays of0.04 eV. By modifying wafer parameters and comparing the simulated TOD, this study is a valuable tool for probing design changes on the thermal background seen by the detectors.
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